- * QFN packages, CMOS Sensor, Universal Application capability.
- * High speed and reliable pick & place system by fully programmable pick & place head.
- * Automatic JEDEC tray load/unload system with pick & place head non-stop function.
- * Quick wafer frame exchange function.
- * Loading/Unloading unit for JEDEC trays or tubes are applicable.
Fully-Auto Package Sorer：KS-922
 |
張欽華 |
T:886-2-22682216 #2001 |
| 規(guī)格 | |
|---|---|
|
Accuracy |
X,Y=±50μm,θ=±0.2° |
|
Cycle Time |
≤0.45sec (Excluding pick and place delay time) |
| UPH | >8K (for QFN size is 4x4mm) |
|
Package Size |
3x3mm ~ 9x9mm |
|
Package Thickness |
0.1mm~0.7mm |
|
Wafer Size |
12" Standard(8" Option) |
| Input JEDEC Tray | Automatic Stacked Loading(20pcs) |
| Output JEDEC Tray | Automatic Stacked Unloading(20pcs) |
| Tube load/unload(option) | Automatic,30pcs |
|
|
