- * Combine 1st-bond & 2nd-bond unit to improve throughput.
- * High throughput for DAF process (UPH > 2.5K).
- * 2nd-bond unit with four independent bonding heads which can independent control bond height and bond force.
- * Substrate pre-heating function to improve DAF bonding quality.
- * Dual feeding system with two independently controlled stage-feeding unit for continuous operation.
- * Improve the quality of substrate transfer by stable feeding unit.(stage unit without jam issue of substrate indexing )
- * Adjustable scraper unit for 1 mil thin die pick-up solution.
Stacked Die Bonder (DAF Process)：KB-3100
 |
張欽華 |
T:886-2-22682216 #2001 |
| 規(guī)格 | |
|---|---|
|
Bonding Accuracy |
±25μm(X/Y placement),±0.5degree(θ rotation) |
|
Throughput(UPH) |
4K(by die size: 240mil x 240mil、2nd-bond time 2.5sec.) |
| Wafer Size | 8 inch ~ 12 inch |
|
Die Size |
0.6x0.6mm~25x25mm/1 mil thickness |
|
Subtrate / Lead-frame size |
(L)100~270mm x (W)20~95mm x (T)0.1~2mm |
|
Substrate Feeding System |
carrier boat feeding type |
| Stacked-die capability | can set X、Y、Z、θ position & bonding time、bond force on every stacked-die at one pad |
|
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